Wakefield Compression Clamp Assemblies for Semicondutors to 3.50in.

Wakefield Max Performance Natural Convection Heat Sink for Metal Case Semiconductors T03

Wakefield PAD, GAP FILLER, 5W/M-K, 26X33X2MM, AU CLR

Wakefield Heatsink; TO-220; Bolt On; Dual Mount; 7C/W

Wakefield Insulator; 4, 000V; 0.007 in.; Gray; TO-220

Wakefield Heatsink; TO-220; Clip-On; 16C/W

Wakefield Insulator; Kapton; Greaseless; 0.006 in.

Wakefield Heatsink; Omnidirectional; 21 mm; Double Tape

Wakefield Heatsink; Quarter Brick; Horizontal; 13 Fin; 2.3 C/W

Wakefield SHEET OF 173-7 SERIES W/ADH BACK

Wakefield Extrusion 1876063T5162-00

Wakefield Ground Bar Kit, 4" x 12" Copper Ground Tin Plated Bar Kit W/ 24 Holes

Wakefield Adhesive/Hardener, Bottle, 0.14 lb, Rigid, High Strength Bond to Most Materials

Wakefield Thermal Adhesive, Deltabond, Bi-Pack, 1oz (30ml), Conductive, Resin and Hardener

Wakefield Compression Clamp Assemblies for Semicondutors to 3.50in.

Wakefield Fast Curing Thermally Conductive Adhesive, 1.69 oz (50mL), Dual Cartridges

Wakefield Non-Sag 5 Minute BondaTherm Epoxy Adhesive, 1.7 oz (50mL) Dual Cartridge

Wakefield Heatsink; TO-220; Bolt On; Dual Mount; 3.6C/W

Wakefield Toughened Flexible BondaTherm Adhesive System, 1.69 oz (50mL) Dual Cartridges

Wakefield Epoxy Dispenser, For 50mL Cartridges, Plastic, BondaTherm Equalizer Series