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AIM Solder 8030
AIM Solder 8030
Underfill FF35; 30cc; for Capillary Flow for Flip Chip; CSP; BGA and MICRO-BGAWe are pleased to offer our customers AIM Solder products with delivery to their respective countries. Please contact us for detailed information about pricing and delivery times. In your request, kindly send information containing product codes and specific details to our [email protected] address.
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AIM Solder 8030 Specifications
Property | Value |
---|---|
Color | Yellow |
Flow Rate | 5 mm/ 1 minute |
Physical State | Liquid |
Primary Type | Epoxy |
Setting Time | Cure time at 100°C — 8-10 minutes, at 125°C &m |
Shelf Life | At 25°C — 1 week, at 5°C — 1 month, at - |
Special Features | Reworkable at 120°C and flows at 120°C - 140°C |
Specific Gravity | 1.25 G/cc |
Temperature Range | 150 ; Maximum C |
Viscosity | At 25°C at 5 RPM — 800 CPS |